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HONYI

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Products

• Memory Flash chips

  MindBrand:Samsung/Intel/SKHynix/Micron/Toshiba/Sandisk

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• FPGA

  Mind Brand: Xilinx/Altera/Lattic

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• DSP

  Mind Brand: TI/AD

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Honyi Industrial Co.,Ltd

Professional reseller for semiconductor components.

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News

• 2021-06-11

  Intel & Micron Sign New 3D XPoint Wafer Supply Agreement

  Intel and Micron have inked a new 3D XPoint memory wafer supply agreement. Analysts believe that Intel will now have to pay Micron more than it did previously as it is now the only maker of 3D XPoint. The new pact also shows that Intel wants to contin...

• 2021-06-11

  Samsung Begins Mass Production of 512 GB eUFS 3.1 Storage: Up to 2.1 GB/s

  Samsung has kicked off mass production of its new, high-performance eUFS 3.1 storage modules. Designed primarily with high-end smartphones in mind, the embedded storage drives offer some of Samsung's fastest speeds yet, with read and write speeds simi...

• 2021-06-11

  DRAMeXchange: Blackout at Samsung’s Fab Will Not Affect Commodity DRAM Prices in Q1

  Following a power outage and consequent disruption of production at Samsung’s Line 13 fab in Hwaseong, South Korea, back on December 31, 2019, there had been some concerns about what the disruption would do to the wider DRAM market. However it seems...

• 2021-06-11

  Samsung Launches Single-Chip uMCP Packages with LPDDR4X DRAM & UFS 3.0 Storage

  Samsung has introduced a new lineup of all-in-one memory packages for smartphones that integrate both DRAM and storage. The latest generation of uMCP devices now feature up to 12 GB of LPDDR4X DRAM as well as NAND flash storage with a UFS 3.0 interfac...

• 2021-06-02

  Micron Kicks Off Mass Production of 12 Gb LPDDR4X DRAM Chips

  South Korean companies produce 70% of the world’s DRAM, about a half of 3D NAND, and a significant share of OLED and LCD displays on the planet. Meanwhile, Japanese suppliers make 70% - 90% of three materials crucially required for manufacturing the...

• 2021-06-02

  Samsung Launches Single-Chip uMCP Packages with LPDDR4X DRAM & UFS 3.0 Storage

  Samsung has introduced a new lineup of all-in-one memory packages for smartphones that integrate both DRAM and storage. The latest generation of uMCP devices now feature up to 12 GB of LPDDR4X DRAM as well as NAND flash storage with a UFS 3.0 interfac...

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